sanken electric co., ltd. fmu - g26s 080723 1 5 61426 - 01 scope the present specifications shall apply to a fmu - g26s . outline high frequency rectification type silicon diode structure resin molded applications high frequency rectification flammability ul94v - 0(equivalent)
sanken electric co., ltd. fmu - g26s 080723 2 5 61426 - 01 absolute maximum rating s no. item symbol unit rating conditions 1 transient peak reverse voltage v rsm v 600 2 peak reverse voltage v rm v 600 3 average forward current i f(av) a 10 refer to derating of 7 4 peak surge forward current i fsm a 40 10ms. half sinewave, one shot 5 i 2 t limiting value i 2 t a 2 s 8 1ms junction temperature t j c - 40 to +150 7 storage temperature t stg c - 40 to +150 8 dielectric strength kv a.c.1.0 lead and case electrical characteristics (ta=25 unless otherwise specified) no. item symbol unit value conditions 1 forward voltage drop v f v 1.35 max. i f =10a 2 reverse leakage current i r ua 50 max. v r =v rm 3 reverse leakage current under high temperature h ? r ua 500 max. v r =v rm , t j =150 c 4 reverse recovery time trr1 ns 4 00 max. if=ir=100ma, 90% recovery point trr2 ns 200 max. if=100ma,ir=200ma, 75% recovery point 5 thermal resistance r th(j - c) c /w 4.0 max. between junction and case
sanken electric co., ltd. fmu - g26s 080723 3 5 61426 - 01 characteristics i f(av) f forward power dissipation (w) average forward current (a) derating t c f(av) average forward current (a) case temperature ( c )
sanken electric co., ltd. fmu - g26s 080723 4 5 61426 - 01 package information - package type, physical dimensions and material dimensions in L - appearance the body shall be clean and shall no t bear any stain, rust or flaw. - marking type name marking type name polarity lot number fmu - g26s fmug26 s 1st letter: last digit of year 2nd letter: month from 1 to 9 for jan. to sep., o for oct., n for nov., d for dec. 3rd & 4th lette r: day ex. 8723 (july 23, 2008) g ? ` ` k w ? ? ? :a
sanken electric co., ltd. fmu - g26s 080723 5 5 61426 - 01 internal structure diagram no. name of part materials frame: heat sink nickel plated copper chip silicon disc nickel plated copper inner leads nickel plated copper wire resin body epoxy re sin frame: pin nickel plated copper + solder dipped weight of products: approx. 2.1g
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